■ Standard Circuit Layer Thickness
The circuit layer is the component-mounting layer in Thermal Clad. Current carrying capability is a key consideration because this layer typically serves as a printed circuit, interconnecting the components of the assembly. The advantage of Thermal Clad is that the circuit trace interconnecting components can carry higher currents because of its ability to dissipate heat due to I2R loss in the copper circuitry.
The following equation can be used to calculate minimum trace width utilizing both circuit thickness and current requirements.
■ Base Thickness
■ Standard Thermal Clad Panels
Available in:
• 18" (457.2mm) x 24" (609.6mm) Usable area: 17" (431.8mm) x 23" (584.2mm)
• 20" (508mm) x 24" (609.6mm) Usable area: 19" (482.6mm) x 23" (584.2mm)
■ Surface Finish
• Aluminum and copper base layers come with a uniform commercial quality brushed surface. Aluminum is also available anodized with choices of clear, black, blue and red colors.
• Two kinds of films which can be used under 160℃，260℃ are available for different manufacturing requirements
• Non-standard thickness are also available.
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