Beijing Ruikai Aluminum base copper-clad laminate
    ·Ruikai Product description
    ·Type/specification
    ·Typical properties
    ·Applications

Bergquist Thermal Clad
    ·Product description
    ·Type/specification
    ·Typical properties
    ·Applications

Bergquist thermal interface materials
    ·Product description
    ·specification/properties
Location: Home >> Products >> Beijing Ruikai Aluminum base copper-clad laminate >> Type/specification     
         Type/specification
 
 
■ Standard Ruikai Panels: 455×605mm(18″×24″)
 
■ Surface Finish
 
     • All the backsides of our panels have been taken the treatment of anodic oxidation in order to protect the boards from scratching or stain while shipping or PCB solder assembly.
     • Two kinds of films which can be used under 120℃，160℃，260℃ are available for different manufacturing requirements
     • Non-standard thickness are also available.
 
 
 


Key Words: Thermal Substrate,Insulated Metal Substrate,Aluminum Base Laminate,MCPCB
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