■Sil-Pad Thermally Conductive Insulators
Sil-Pad thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications. Bergquist application specialists work closely with customers to specify the proper Sil-Pad material for each unique thermal management requirement.
Sil-Pad Benefits
• Excellent thermal performance
• Eliminates the mess of grease
• More durable than mica
• Less costly than ceramic
• Resistant to electrical shorting
• Easier and cleaner to apply
• Under time and pressure, thermal resistance will decrease
• Better performance for today’s high-heat compacted assemblies
• A specific interfacial performance that matches the need
• Efficient “total applied cost” that compares favorably with other alternatives
■Gap Pad/ Gap Filler
The extensive Gap Pad family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. Bergquist application specialists work closely with customers to specify the proper Gap Pad material for each unique thermal management requirement.
Gap Pad Benefits
• Eliminates air gaps to reduce thermal resistance
• High conformability reduces interfacial resistance
• Low-stress vibration dampening
• Shock absorbing
• Easy material handling
• Simplified application
• Puncture, shear and tear resistance
• Improved performance for high-heat assemblies
• Compatible with automated dispensing equipment
Gap Filler Benefits
• Thermal conductivity: 1.0 W/m-K
• Ultra-conforming, designed for fragile and low-stress applications
• Ambient and accelerated cure schedules
• 100% solids – no cure by-products
• Excellent low and high temperature mechanical and chemical stability
■Bond-Ply/Liqui-Bond Adhesives
Bond-Ply Benefits
• Provide an excellent dielectric barrier
• Excellent wet-out to most types of component surfaces including plastic
• Bond-Ply 400 is unreinforced to increase conformance and wet-out on low surface energy materials
• Eliminates need for screws, clip mounts or fasteners
Liqui-Bond Benefits
Before cure, Liqui-Bond flows under pressure like a grease. After cure, it bonds the components, eliminating the need for mechanical fasteners. Additional benefits include:
• Low modulus provides stress-absorbing flexibility
• Supplied as a one-part material with an elevated temperature curing system
• Offers infinite thickness with little or no stress during displacement
• Eliminates need for pad thickness and die-cut shapes for individual applications
■Hi-Flow Phase Change Interface Materials
The Hi-Flow family of phase change thermal interface materials covers a wide range of applications.The Bergquist Company is a leader in thermal management solutions and works closely with customers to ensure that the proper Hi-Flow material is specified
Hi-Flow Benefits
• No mess – thixotropic characteristics of the materials keep it from flowing out of the interface
• Easier handling – tackified or tack-free at room temperature
• Does not require protective liner
• High thermal performance helps ensure CPU reliability
• Does not attract contaminants
• Easier material handling and shipping
• Simplified application process
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